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3d Integration

All articles tagged with #3d integration

"Maximizing Moore's Law: Advancements in 3D Integration for Computer Chips"

Originally Published 2 years ago — by Tech Xplore

Penn State researchers have demonstrated a breakthrough in 3D integration of semiconductors using 2D transistors made with 2D semiconductors, offering a solution to the limitations of Moore's Law. This approach not only allows for more silicon-based transistors on a computer chip but also enables the use of transistors made from 2D materials to incorporate diverse functionalities within various layers of the stack. The researchers achieved monolithic 3D integration at a massive scale, characterizing tens of thousands of devices, bridging the gap between academia and industry and potentially advancing the semiconductor industry.

technology technology 2d-materials 3d-integration electronics moores-law semiconductors technology

"Advancing Electronics: 2D Integration for 3D Computer Chips"

Originally Published 2 years ago — by Nature.com

Researchers have achieved a significant advancement in nanoelectronics by integrating two-dimensional field-effect transistors into a three-dimensional structure. This breakthrough paves the way for the development of more efficient and compact electronic devices. The study, conducted at Penn State University, utilized 2D materials such as MoS2 and WSe2 to create the transistors, demonstrating the potential for enhanced performance and scalability in semiconductor technology. The research holds promise for the future of integrated circuits and could lead to innovations in areas such as in-memory computing and flexible electronics.

technology technology 2d-materials 3d-integration field-effect-transistors nanoelectronics semiconductor technology