All articles tagged with #heat dissipation
Apple is planning to introduce vapor chamber cooling technology to the iPad Pro, similar to what was implemented in the iPhone 17, to better manage heat generated by high-performance tasks, with an expected release around spring 2027.
Stress tests reveal that the M3 MacBook Air loses nearly 50 percent of its performance when used in clamshell mode, due to heat dissipation issues with the fan-less design. With the lid opened, the performance drop is around 30 percent, making it significantly better. The high temperatures reached during stress tests indicate a need for improved heat dissipation, possibly through the addition of a cooling fan in future versions.
A leaked photo of an alleged prototype battery for the iPhone 16 Pro reveals a new metal shell design, which could potentially improve heat dissipation. The battery has a capacity of 3,355 mAh, slightly higher than the iPhone 15 Pro. While it's uncertain if this design will be used in the final product, it suggests that Apple is working on improving thermals for the next iPhone. Rumors also suggest that the iPhone 16 Pro will have larger screen sizes, better camera lenses, and faster connectivity.
Chip companies are exploring alternative materials like synthetic diamond and ultrapure glass to address the increasing heat generated by high-performance microchips. Diamond, known for its excellent heat conductivity, is being used by Diamond Foundry to create large wafers that can be bonded with silicon microchips, allowing for faster heat dissipation. Intel is working on using glass substrates to support larger microchips and enable faster communication between them. In the future, scientists are considering replacing silicon with materials like boron arsenide, which can transmit heat efficiently and potentially enable faster computational logic.
Chip companies are exploring the use of unconventional materials like synthetic diamond and ultrapure glass to address the heat dissipation challenges caused by the increasing power and functionality of microchips, which can limit their performance.
Researchers have developed a nanocomposite film using a two-solution coaxial electrospinning method that dissipates heat four times more effectively than existing materials, offering a potential solution for overheating in compact electronics. The film creates a "highway" of heat distribution using polyvinyl alcohol and thermally conductive nanodiamond material. The coated fibers direct heat along and across the fibers throughout the film, making it more thermally conductive than previously reported nanocomposites.