"World's Largest Diamond Unlocks Breakthrough in Microchip Speed"

Chip companies are exploring alternative materials like synthetic diamond and ultrapure glass to address the increasing heat generated by high-performance microchips. Diamond, known for its excellent heat conductivity, is being used by Diamond Foundry to create large wafers that can be bonded with silicon microchips, allowing for faster heat dissipation. Intel is working on using glass substrates to support larger microchips and enable faster communication between them. In the future, scientists are considering replacing silicon with materials like boron arsenide, which can transmit heat efficiently and potentially enable faster computational logic.