Reviving TSMC's Arizona Fab: A Game-Changing Chip-Packaging Facility
Originally Published 2 years ago — by Ars Technica
Apple has partnered with Amkor to solve the issue of chip packaging at Taiwan Semiconductor's (TSMC) Arizona-based fab. Amkor will invest $2 billion to build a facility that will handle chip packaging, making the Arizona factory operational. TSMC's Arizona facility is scheduled to open in 2025, and Amkor's packaging facility will be ready for production within the next two to three years. This partnership will allow Apple to buy chips made in the US, reducing reliance on chips made in Taiwan. Both TSMC and Amkor may benefit from government subsidies provided by the CHIPS Act. However, achieving full independence in the US chipmaking supply chain may take between a decade and two decades.