All articles tagged with #2nm process
Rumors from a known Weibo leaker suggest the iPhone 18 Pro Max will sport a 5,100–5,200 mAh battery and use an A20 Pro chip built on a 2nm process, potentially delivering over 40 hours of battery life; the phone may be thicker to fit the larger cell, and a foldable iPhone debuting with the 18 lineup is also rumored to have a large battery (over 5,500 mAh).
Rumors say Qualcomm will use Heat Pass Block copper heatsinks on the Snapdragon 8 Elite Gen 6 Pro and Gen 6 to curb temperatures as clocks rise toward 5 GHz, with TSMC’s 2nm process expected to help but not fully solve cooling in smartphones; testing reportedly shows 5.00 GHz potential in ideal conditions, making an advanced cooling solution like HPB seem necessary—though no official confirmation has emerged.
Rumors peg the standard iPhone 18 for an early 2027 debut (with Pro models in Sep 2026), keeping a design similar to the iPhone 17 while upgrading core hardware: a 2nm A20 chip delivering roughly 10–15% performance gains, ~12GB RAM with Samsung LPDDR5X memory, and Samsung-made stacked image sensors. A simplified Camera Control feature is suggested for the base model, and under-display Face ID appears unlikely on the non-Pro variant.
Samsung’s Exynos 2600 uses Heat Pass Block to cut thermal resistance by about 16%, enabling higher sustained clocks; rumors suggest other Android chip makers, including Qualcomm, may adopt HPB to handle rising performance on 2nm designs, though specific manufacturers named remain unconfirmed.
Rumors for Apple’s iPhone 18 Pro lineup point to a September launch featuring 6.3-inch and 6.9-inch displays, under‑screen Face ID, an A20 Pro chip built on a 2nm process, a redesigned rear camera module, potential front-camera changes, upgraded MagSafe/Ceramic Shield, Apple-designed 5G/Wi‑Fi/Bluetooth modems, satellite web browsing, and new color options.
Samsung announced the Exynos 2600, the world's first 2nm smartphone chip, featuring a 10-core CPU, improved performance and efficiency, advanced AI capabilities, and enhanced thermal management, expected to power the Galaxy S26 series.
Samsung's Exynos 2600 chip has entered mass production and will be used in the Galaxy S26 Pro model, marking a comeback for Exynos in select markets, with the chip fabricated on a 2nm process offering improved performance and efficiency.
TSMC's upcoming 2nm process is expected to see higher demand than 3nm due to its cost efficiency and advanced transistor structure, with major industry players like Apple, MediaTek, Qualcomm, NVIDIA, and AMD anticipated to adopt it early, leading to significant production ramp-up by 2026-2027.
Analysts reveal preliminary specs for the upcoming foldable iPhone, including a 2nm A20 Pro chip, 12GB RAM, and a foldable design with a 5.5-inch cover screen and 7.8-inch inner display, expected to launch in late 2026 with premium features and a high price point.
Google plans to use TSMC's 2nm process for the Tensor G6 chip in the Pixel 11 series in 2026, potentially surpassing competitors like Qualcomm in process technology, marking a significant advancement in Google's chip development timeline.
Qualcomm's upcoming Snapdragon 8 Elite Gen 3 may be released in two versions due to high manufacturing costs of 2nm wafers, similar to Apple's A18 and A18 Pro, with potential dual sourcing from Samsung and TSMC to mitigate supply issues and costs.
Qualcomm is considering using Samsung Foundry's 2nm process for its future flagship Snapdragon processors, potentially moving away from TSMC. While TSMC currently dominates the semiconductor chip manufacturing segment, Samsung Foundry is aiming to close the gap with its 2nm technology. However, doubts remain about Samsung's ability to produce highly complex chips with a high yield. Intel, Samsung, and TSMC are all targeting mass production of 2nm chips by 2025, but experts suggest that the performance gains from smaller chips may not be as significant as before. Despite concerns about design leaks, Samsung Foundry could benefit from customers' interest in diversifying their supply chain.
Apple is reportedly set to receive a discount on TSMC's upcoming 2nm process, with each wafer costing $25,000. The high cost of TSMC's 3nm process has deterred other companies from placing orders, allowing Apple to secure 90 percent of the initial supply. TSMC's 2nm wafers are said to be 25 percent more expensive than the 3nm ones. Despite the high cost, Apple is expected to place enough orders to receive a discount, similar to its arrangement for the 3nm process. TSMC is in talks with various clients for mass production in 2025, but currently, Apple and NVIDIA are the only ones interested.
Rumored details about Intel's 15th Gen Arrow Lake CPUs include up to 40 cores, a 30% performance boost, and a 2nm (20A) process with backside power delivery and Nanoribbon transistors. The desktop chips will feature a chiplet design with four tiles, including Compute or CPU, Graphics, SoC, and I/O. The iGPU is expected to have gaming performance on par with low-end dGPUs. Arrow Lake-S is expected to arrive in late 2024.
An AMD engineer inadvertently leaked the first details about the Zen 6 Morpheus CPU, including its codename and the fact that it will be based on a 2nm process. The engineer's LinkedIn profile also revealed that he has been working on Zen 4 and Zen 5, with Zen 5 expected to be released later this year. Zen 5 is rumored to bring a hybrid big-little design to Ryzen, while Zen 6 is expected to be a refinement of the technology.