All articles tagged with #a20 chip
A Chinese leak claims the iPhone 18 Pro has entered late-stage production testing ahead of a September launch, with no major exterior design changes but internal upgrades including a variable-aperture camera, the A20 chip, and a C2 modem; the regular iPhone 18 is also reportedly testing, and Bloomberg notes Apple's foldable could steal the spotlight this fall.
Rumors suggest the iPhone 18 Pro/Pro Max will largely resemble the iPhone 17 Pro but with a bigger Pro Max battery (≈5,100–5,200 mAh) and a thicker body, while moving to Apple’s A20 chip on a 2nm process and an in-house C2 modem; whispers also point to a possible under-display Face ID or slimmer Dynamic Island, a Samsung-made 3-layer image sensor, and a variable-aperture lens, plus 5G satellite internet and new colors like burgundy, brown, and purple. Release is reportedly in two phases: Pro models in Sept 2026, with the rest in spring 2027.
Rumors peg the standard iPhone 18 for an early 2027 debut (with Pro models in Sep 2026), keeping a design similar to the iPhone 17 while upgrading core hardware: a 2nm A20 chip delivering roughly 10–15% performance gains, ~12GB RAM with Samsung LPDDR5X memory, and Samsung-made stacked image sensors. A simplified Camera Control feature is suggested for the base model, and under-display Face ID appears unlikely on the non-Pro variant.
Next year's iPhone models may see higher prices due to the increased cost of the new A20 chip, which is expected to be built on a costly 2-nanometer process by TSMC, potentially leading to a significant price hike for Apple products.
Upcoming iPhone models, including the iPhone 18 Pro and iPhone Fold, are expected to feature the new A20 chip made with 2nm technology and a C2 modem supporting faster mobile data, potentially offering improved performance and 5G speeds. These upgrades highlight Apple's focus on advancing processing power and connectivity in future devices.
Apple plans to introduce its A20 chip in the 2026 iPhones, featuring advanced multi-chip packaging (WMCM) that integrates components at the wafer level for improved performance and efficiency, marking a significant leap in mobile chip design and potentially setting new industry standards.