The 2nm Chip Showdown: TSMC vs Samsung for Flagship Supremacy
Originally Published 2 years ago — by Nikkei Asia
In 2009, Chiang Shang-yi, head of research and development at Taiwan Semiconductor Manufacturing Co., proposed exploring chip packaging as a solution to the chip industry's problem of fitting more transistors onto smaller chips. This alternative approach aimed to make chips more powerful without relying solely on shrinking their size.