MIT Develops Faster and More Efficient Method for Integrating 2D Materials onto Silicon Circuits.

TL;DR Summary
Researchers have developed a method to retain the mechanical properties of 2D polymers called covalent organic frameworks (COFs) when stacked in multiple layers, creating a lightweight material that is several times stronger than steel. Potential applications include filtration membranes and upgraded batteries. The research could also impact the design of ceramics and metals, potentially enabling their manufacturing and repair at lower temperatures. The findings are detailed in a new study published in Proceedings of the National Academy of Sciences.
Topics:science#2d-materials#covalent-organic-frameworks#hydrogen-bonding#mechanical-properties#potential-applications#science-and-technology
- Molecular Magic – Researchers Develop Lightweight 2D Material Stronger Than Steel SciTechDaily
- New Low-Temp Growth & Fabrication Technology Allowing Integration of 2D Materials Directly Onto A Silicon Circuit (MIT) SemiEngineering
- MIT Researchers Successfully Integrate 2D Materials Directly on Silicon Circuit HPCwire
- MIT researchers unveil faster method of "growing" 2D transistors on top of wafers TechSpot
- MIT engineers ‘grow’ atomically thin transistors to make super dense computer chips The Indian Express
Reading Insights
Total Reads
0
Unique Readers
1
Time Saved
4 min
vs 4 min read
Condensed
90%
783 → 79 words
Want the full story? Read the original article
Read on SciTechDaily