
TSMC to Accelerate US Transfer of Chipmaking Know-How While Keeping Top Tech at Home
TSMC plans to speed up moving its advanced chipmaking expertise to the US—expanding its Arizona footprint while keeping the most cutting-edge processes in Taiwan. Even with faster transfers, the newest tech would still be moved abroad only after stabilization and would take at least a year. The company is pursuing a record capex this year (over $52 billion) and about $165 billion to build US capacity, with mass production at its second Arizona fab expected in 2027; North American customers now account for roughly 75% of revenue.
