All articles tagged with #thermal performance
The iPhone 17 Pro finally lives up to its 'Pro' label with improved thermal performance thanks to a switch back to aluminum, a shared display tech with the standard model, and features tailored for professional users like videographers and gamers, while the design shifts focus away from flashy aesthetics to functionality.
The M3 MacBook Air reaches peak CPU temperatures of 114 degrees Celcius and experiences a 33% performance slowdown compared to the MacBook Pro with the same chip, due to its fan-less cooling design. The high temperatures also lead to uncomfortable exterior chassis temperatures. Modding the heatsink with thermal pads can help improve sustained performance, but Apple has yet to address this issue in its design.
Hardware expert Der8auer delidded the AMD Ryzen 7 8700G APU, revealing its die and achieving a significant temperature reduction of up to 25 degrees by applying liquid metal. The delidding process involved using a delidding tool from Thermal Grizzly, and despite the APU's lower die height, thermal performance improved with the use of graphene thermal pads and liquid metal. While delidding may not have widespread market potential, it proved beneficial for reducing thermals and increasing clock speeds in constrained cooling setups.
ACER's innovative GeForce RTX 4090 GPU with built-in liquid cooling fails to impress in thermal and noise tests, performing slower and hotter than other custom designs. Despite its unique approach, the ACER Predator GPU disappoints in terms of thermals and acoustics, making it a questionable choice for its high price point. More tuning and refinement are needed for future releases.
Samsung is reportedly upgrading the cooling systems in its upcoming Galaxy S24 series, with larger vapor chambers planned for improved thermal performance. The Galaxy S24 Ultra will have a vapor chamber 1.9x larger than its predecessor, while the S24+ and S24 will feature vapor chambers 1.6x and 1.5x larger, respectively. These upgrades will help manage heat and improve sustained performance, particularly for models equipped with the Exynos 2400 chipset.
The upcoming Pixel 8 series may address the overheating issues of previous models with the introduction of the Tensor G3 chip, which incorporates Fan-out Wafer-level Packaging (FO-WLP) technology. FO-WLP improves the thermal and electrical performance of the chip. In addition to better heat management, the Tensor G3 is expected to bring upgrades such as a restructured nine-core layout and a more powerful GPU, potentially rivaling the Snapdragon 8 Gen 2. However, it is still manufactured on Samsung's 4nm production line, which has previously caused overheating problems.