"Pixel 8's Tensor G3: Cooler Performance and Improved Heat Management"

The upcoming Pixel 8 series may address the overheating issues of previous models with the introduction of the Tensor G3 chip, which incorporates Fan-out Wafer-level Packaging (FO-WLP) technology. FO-WLP improves the thermal and electrical performance of the chip. In addition to better heat management, the Tensor G3 is expected to bring upgrades such as a restructured nine-core layout and a more powerful GPU, potentially rivaling the Snapdragon 8 Gen 2. However, it is still manufactured on Samsung's 4nm production line, which has previously caused overheating problems.