All articles tagged with #smartphone chipset
The Samsung Galaxy S26 series is expected to be announced earlier than previously thought, on February 25 in San Francisco, featuring next-gen AI and returning to in-house Exynos chipsets, with delays possibly leading to better specs and larger batteries.
MediaTek's upcoming Dimensity 9500 chipset is set to significantly outperform its predecessors with higher clock speeds, increased cache, a new GPU microarchitecture, and advanced AI capabilities, promising top-tier performance upon its launch.
Samsung's upcoming Exynos 2600 chipset, built on a 2nm GAA process, has been spotted in early benchmark tests revealing a 10-core '1+3+6' CPU cluster and a maximum clock speed of 3.55GHz. Although initial scores are low, these are early results, and the chipset is expected to improve before its anticipated release in the Galaxy S26 series next year.
MediaTek's upcoming Dimensity 9400 smartphone chipset is rumored to feature the largest die size ever seen in a smartphone platform, with over 30 billion transistors, a 32% increase from its predecessor. The larger die size is expected to result in increased cost but also promises improved GPU performance and efficiency, potentially surpassing the Snapdragon 8 Gen 4. The use of TSMC's 3nm 'N3E' process for mass production could make it MediaTek's most expensive smartphone SoC yet. The increase in die size may address previous overheating and power consumption issues, but this has not been confirmed.
Qualcomm has unveiled the Snapdragon 8s Gen 3, a high-end smartphone chipset designed for more affordable flagship killer phones. The chip, made by TSMC, features a downclocked CPU and a slightly downgraded GPU compared to the Snapdragon 8 Gen 3, but still offers advanced camera processing, connectivity, and on-device AI capabilities. It will be used in upcoming smartphones from brands like Honor, iQOO, Realme, Redmi, and Xiaomi, with Xiaomi set to launch the first Snapdragon 8s Gen 3-equipped phone in March 2024.