"MediaTek's Dimensity 9400: The Smartphone Chipset with Over 30 Billion Transistors"
Originally Published 1 year ago — by Wccftech
MediaTek's upcoming Dimensity 9400 smartphone chipset is rumored to feature the largest die size ever seen in a smartphone platform, with over 30 billion transistors, a 32% increase from its predecessor. The larger die size is expected to result in increased cost but also promises improved GPU performance and efficiency, potentially surpassing the Snapdragon 8 Gen 4. The use of TSMC's 3nm 'N3E' process for mass production could make it MediaTek's most expensive smartphone SoC yet. The increase in die size may address previous overheating and power consumption issues, but this has not been confirmed.