All articles tagged with #packaging technology
Intel has demonstrated its advanced packaging capabilities, enabling the integration of up to 16 compute dies and 24 HBM5 memory modules in a single package using Foveros 3D and EMIB-T interconnects, leveraging its 18A and 14A process nodes, with plans for high-power GPU designs and competitive positioning against TSMC.
Intel's former 'Inventor of the Year' Gang Duan, a key figure in glass substrate and EMIB technology development, has left Intel for Samsung, signaling potential setbacks for Intel's ambitions in glass substrate technology and highlighting recent strategic shifts and layoffs within the company.
Intel is developing a new glass substrate technology that could revolutionize processors and meet the increasing demand for computing power. The glass foundation, called a substrate, offers higher speed, power, and real estate for packaging multiple "chiplets" into a single processor. This technology could enable processors with a trillion transistors by the end of the decade. Intel's glass substrate technology demonstrates its packaging prowess and may give the company a competitive advantage. The transition to glass substrates is expected to begin in the second half of the decade, starting with high-end processors for data centers and eventually spreading to consumer applications like laptops.