Intel Plans Compact Chip with 16 Compute Dies and 24 HBM5 Modules
Intel has demonstrated its advanced packaging capabilities, enabling the integration of up to 16 compute dies and 24 HBM5 memory modules in a single package using Foveros 3D and EMIB-T interconnects, leveraging its 18A and 14A process nodes, with plans for high-power GPU designs and competitive positioning against TSMC.