
Dimensity 9600 Could Power China’s Next Flagship Phones Amid Qualcomm Price Pressure
MediaTek’s Dimensity 9600 is rumored to use TSMC’s N2P process and could become a popular choice for upcoming Oppo and Vivo flagships as OEMs seek alternatives to Qualcomm’s high-priced chips, with claims of potential performance and memory-bandwidth advantages, though official details are not yet confirmed.













