All articles tagged with #ddr5
Maingear has launched a BYO RAM program allowing customers to supply their own DDR5 memory for custom PCs amid a severe RAM shortage and skyrocketing prices, with the company testing and validating all memory to ensure compatibility. The ongoing crisis, driven by high demand and supply constraints, has led other PC builders to adopt similar no-RAM options, while scams involving DDR5 kits are also increasing.
AMD is updating its EXPO technology to version 1.2, which will support new features like CUDIMMs and potentially offer improved memory overclocking profiles, possibly enhancing late-cycle Ryzen 7000 and 9000 series performance.
Rising RAM prices have led to a 40-50% decline in motherboard sales, impacting the overall PC hardware market and likely causing a slowdown in CPU sales as well, due to delayed upgrades and new builds.
V-Color has announced its new OC RDIMM DDR5 memory modules for AMD's Ryzen Threadripper 9000 series, offering capacities up to 1TB and speeds up to 8200 MT/s, designed for high-performance, AI, and creative workloads with extensive validation for stability and reliability.
MSI has unveiled its Z790 Project Zero Plus motherboard, which supports the innovative DDR5 CAMM2 memory modules. CAMM2 is designed to improve upon the SO-DIMM form factor by reducing space requirements and optimizing signal and power traces. This motherboard, which supports Intel's 14th Generation Core processors, is largely a proof-of-concept showcasing new technologies, including backside power connectors for better cable management. MSI will showcase this platform at Computex, alongside Kingston's Fury Impact CAMM2 memory module.
Intel is set to release its 15th Generation Arrow Lake processors later this year, featuring a new Core Ultra 200 naming scheme and a new LGA1851 processor socket, requiring a new motherboard. The processors are rumored to abandon Hyper-Threading, support only DDR5 memory, and offer up to 24 cores, with the flagship Core i9-14900K and 14900KS featuring 24 cores. These changes indicate a significant departure from the current 14th Gen models and suggest a faster, more efficient, and less power-hungry architecture.
The demand for RAM in gaming PCs has surged due to increasing system requirements in games, with many AAA titles now requiring over 16GB of RAM for smooth gameplay. The shift to DDR5 memory has led to more reasonable prices, making it a good time to upgrade to 32GB of RAM for a smoother gaming experience. With DDR5 becoming the new standard and the evolution in RAM requirements showing no signs of slowing down, investing in 32GB of RAM is seen as the new sweet spot for gaming PCs.
Crucial has launched the DDR5 Pro Memory: Overclocking Edition series, targeting the latest AMD and Intel processors with DDR5-6000 speed, XMP 3.0, and AMD EXPO support. Available in 16GB and 24GB capacities, the memory modules feature timings of 36-38-38-80 at 1.35V, positioning them as a mid-range option for overclocking enthusiasts. While only the 16GB modules are currently available, the 24GB ones are expected to hit the market in late 2024. Crucial's new memory kits are backed by a limited lifetime warranty and are designed to offer competitive performance and pricing for high-end PC builds.
MaxSun is set to release the H770YTX Terminator, an unconventional YTX form factor motherboard with a wider ITX design, offering support for DDR5 technology, PCIe Gen5, and multiple storage options. The mid-range board features back-sided connectors, extra M.2 slots, and storage connectors, as well as 8+1+1 power stage system support for Intel 12th, 13th, and 14th Gen Core CPUs. Priced at 899 RMB ($126), it also includes PCIe Gen4x4 M.2 interfaces, four SATA ports, a 4-lane SlimNAS SFF-8654 interface, and networking capabilities through a 2.5Gbit port and WiFi-6 standard.
Details of Intel's upcoming Arrow Lake-S desktop CPU platform have been leaked, revealing CPUs with up to 24 cores and 32 threads, featuring Lion Cove P-Core and Skymont E-Core architecture. The platform will be supported by 800-series motherboards, offering DDR5-6400 memory and native x16 PCIe Gen5 dGPU support. The CPUs are expected to launch in the second half of 2024, positioning them to compete against AMD's Zen 5-based Ryzen "Granite Ridge" CPUs.
ASRock is set to launch its new DeskMeet X600 and Desk Mini X600 Mini Barebone PCs at CES 2024, featuring support for AMD AM5 CPUs, DDR5 memory, and PCIe Gen5. These Mini-PCs are designed to be compatible with the upcoming Ryzen 7000 and 8000G series processors, with the latter confirming a 65W TDP. The DeskMeet X600 will also support discrete graphics with a full-sized PCIe Gen5 x16 slot, differentiating it from the smaller DeskMini. The new systems will replace the older AM4-based X300 models, marking a significant upgrade in ASRock's Mini-PC offerings.
MSI has announced that its X670 motherboards will now support up to 256GB of memory capacity, thanks to a collaboration with Kingston and their Fury Renegade DDR5 memory modules. This achievement is made possible by the development of 64GB memory capacity per module, allowing for a total capacity of 256GB on motherboards with four DIMM slots. Compatible platforms will receive a BIOS update from MSI to enable this increased memory support.
JEDEC has published the JESD318: Compression Attached Memory Module (CAMM2) standard, which aims to replace the traditional SO-DIMM memory module. CAMM2, originally introduced by Dell, offers thinner designs and faster speeds than SO-DIMM. The standard includes DDR5 and LPDDR5/5X designs, with capacities ranging from 8GB to 128GB on a single module. CAMM2 modules provide the potential for thinner computer designs and dual-channel memory configurations, offering more bandwidth. While it may take years for CAMM2 to overtake SO-DIMM, the standardization is expected to drive adoption and make the modules more affordable in the future.
JEDEC has officially published the CAMM2 memory module standard, which offers higher capacities, faster speeds, and space savings. CAMM2 is a slim memory standard designed for laptops and portable platforms, providing maximum performance and easy field-repairability. It offers advantages over traditional SO-DIMM modules, including a slimmer design and faster communication between RAM and the CPU. CAMM2 comes in DDR5 and LPDDR5/5X versions, catering to different use cases. Samsung and Micron have announced plans to offer CAMM2 modules with capacities up to 128 GB and speeds up to 8533 MT/s. However, one drawback is that upgrading or swapping out CAMM2 modules may require replacing the entire module.
Micron is introducing 128 GB DDR5 RDIMMs capable of operating at up to 8000 MT/s, with mass-production scheduled for 2024. These RDIMMs use 32 Gb monolithic DDR5 dies, which have a 45%+ increase in bit density and offer improved energy efficiency and faster operation compared to 3D stacking (3DS) TSV offerings. Micron's 1β technology allows for optimized data input buffers and critical I/O circuits, reducing power and improving speeds. The company sees a clear path to even higher-density monolithic dies in the future. Micron also outlined its roadmap for upcoming products, including HDM, GDDR7, LPDDR5X, and LPCAMM2 solutions.