"Flexible PCB Enables NVMe Chip Integration in iPhone 6S"

A research team successfully tapped into the NVMe chip of an iPhone 6S using a flexible printed circuit (FPC) BGA interposer, showcasing the process of accessing the chip's communications. The team, experienced in hardware reverse-engineering, detailed the steps involving BGA soldering and interposer creation, ultimately successfully booting the iPhone 6S and scoping the data lines. This development holds promise for further iOS and iPhone hardware reverse-engineering, and the researchers have a track record of exploring security research in various devices.