TSMC Explores Advanced Chip Packaging Expansion in Japan

Taiwan's TSMC is considering building advanced chip packaging capacity in Japan, potentially bringing its CoWoS technology to the country, as part of Japan's efforts to revitalize its semiconductor industry. TSMC's plans in Japan include building a plant and establishing a research and development center, with the company partnering with Japanese firms like Sony and Toyota. The move comes amid a global surge in demand for advanced semiconductor packaging, driven by the artificial intelligence boom, and reflects Japan's aim to play a larger role in advanced packaging.