TSMC Explores Advanced Chip Packaging Expansion in Japan

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly considering building advanced chip packaging capacity in Japan, potentially bringing its chip on wafer on substrate (CoWoS) technology to the country. This move would add momentum to Japan's efforts to revitalize its semiconductor industry, with TSMC already having established operations and partnerships in Japan. The demand for advanced semiconductor packaging has surged globally, and TSMC's potential expansion into Japan aligns with the industry trend.