
Qualcomm Targets Thermal Fix for Snapdragon 8 Gen 6 with Copper HPB Heatsink
Rumors say Qualcomm will use Heat Pass Block copper heatsinks on the Snapdragon 8 Elite Gen 6 Pro and Gen 6 to curb temperatures as clocks rise toward 5 GHz, with TSMC’s 2nm process expected to help but not fully solve cooling in smartphones; testing reportedly shows 5.00 GHz potential in ideal conditions, making an advanced cooling solution like HPB seem necessary—though no official confirmation has emerged.


