Micron's Advancements in DRAM Technology: Higher Capacities and Enhanced Performance
Micron has published its updated DRAM roadmap, revealing plans for high-capacity DDR5 memory devices, GDDR7 chips for graphics cards, and HBMNext for AI and high-performance computing applications. Micron aims to release 32 Gb DDR5 memory dies in the first half of 2024, enabling the production of 32 GB DDR5 modules with lower costs. The company also plans to introduce 128GB DDR5 modules in 2024, with further capacity expansions in 2025. Additionally, Micron is preparing for the launch of GDDR7 memory in the first half of 2024, offering increased bandwidth for next-generation graphics processors. In the HBM space, Micron is developing HBMNext with capacities of 36 GB and 64 GB, boasting high bandwidth per stack for AI and HPC applications.