Canon's Nanoimprint Lithography System Challenges ASML in Semiconductor Manufacturing
Canon has launched the FPA-1200NZ2C nanoimprint semiconductor manufacturing equipment, expanding its lineup to meet the needs of various users. This equipment uses nanoimprint lithography (NIL) technology to transfer circuit patterns by pressing a mask onto the wafer, allowing for faithful reproduction of fine circuit patterns. It enables patterning with a minimum linewidth of 14 nm, equivalent to the 5-nm-node required for advanced logic semiconductors. The new product also features environment control technology to suppress contamination and reduce defects, contributing to the manufacture of cutting-edge semiconductor devices. Additionally, it reduces power consumption and can be used for applications such as metalenses for XR technology.