Apple is preparing to launch four new 2nm chipsets in 2026, including the A20 and A20 Pro with advanced WMCM packaging, which will enhance performance and efficiency. The company is expected to incorporate these chips into upcoming iPhones, MacBooks, and the Vision Pro headset, giving it a competitive edge as other manufacturers like Qualcomm and MediaTek also plan to introduce 2nm chips. TSMC's 2nm technology will be in high demand, with significant production capacity and high costs.
Apple plans to use TSMC's advanced WMCM packaging for its upcoming A20 and A20 Pro chips, and SoIC packaging for its server chips, starting in 2026, with new manufacturing facilities set up to support these technologies, aiming for smaller, more efficient chips with enhanced performance.
Rumors suggest that Apple's A20 chip, likely to be exclusive to the iPhone 18 Pro, iPhone 18 Pro Max, and foldable iPhone 18 Fold, will be manufactured using TSMC's advanced 2nm process with WMCM packaging, offering improved performance and power efficiency. The new chip is expected to be 15% faster than the A19, with no increase in RAM, and production will begin in late 2026. It remains unclear if lower-end models will also feature WMCM packaging.
