Intel's Groundbreaking Glass Substrates Revolutionize Computing Power

Intel has announced the development of industry-leading glass substrates for advanced packaging, which will enable the scaling of transistors in a package and advance Moore's Law. Glass substrates offer superior properties such as ultra-low flatness, better thermal and mechanical stability, and higher interconnect density, making them ideal for high-performance chip packages for data-intensive workloads like AI. Intel plans to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the semiconductor industry to continue scaling beyond 2030.