Intel's Groundbreaking Glass Substrates Pave the Way for Future Chip Advancements

Intel has announced a breakthrough in the development of glass substrates for chip packaging, aiming to advance Moore's Law. The use of glass substrates will enable Intel to create larger chip packages, allowing for more chips to be fitted into a single electrical package. By the end of the decade, Intel foresees packaging 30 trillion transistors on a glass substrate, along with other innovations such as 3D stacking of chips. Glass substrates offer advantages such as enhanced thermal and mechanical stability, higher interconnect density, and improved power delivery, making them suitable for data-intensive applications like AI. Intel plans to introduce comprehensive glass substrate solutions to the market in the latter half of this decade, ensuring the continuation of Moore's Law beyond 2030.