"Intel's Next-Gen Lunar Lake Chip: 3X NPU Uplift and On-Package Memory for Mobile CPUs"

During Intel's CES keynote, EVP Michelle Johnston Holthaus briefly showcased a finished Lunar Lake chip, hinting at the upcoming next-gen mobile CPU's use of on-package memory, a first for Intel's Core chips. The chip features two DRAM packages, promising significant IPC improvements for the CPU core and three-times the AI performance for the GPU and NPU. While specific details on Lunar Lake remain scarce, Intel aims to launch it in 2024, demonstrating ongoing progress and innovation in the realm of mobile computing.