"SK Hynix Invests $3.87 Billion in US Chip Packaging Plant"
TL;DR Summary
SK Hynix, the world's second-largest memory chip maker, is set to invest $3.87 billion in building an advanced packaging plant and research facility for AI products in Indiana, USA. The new plant will mass-produce next-generation high bandwidth memory (HBM) chips, used in graphic processing units for training artificial intelligence systems, and is expected to start production in the second half of 2028. The investment aims to strengthen the supply chain resilience for AI chips in the US and is part of SK Hynix's commitment to invest $15 billion in the semiconductor industry, including the creation of an advanced packaging and testing facility in the US.
- Nvidia supplier SK Hynix to invest $3.87 bln in US chip packaging plant Reuters
- Nvidia Partner Bets $3.9 Billion on the Midwest's Chip-Making Potential The Wall Street Journal
- South Korean computer chipmaker plans $3.87 billion Indiana semiconductor plant and research center The Hill
- SK hynix announces semiconductor advanced packaging investment in Purdue Research Park Purdue University
- Nvidia supplier SK Hynix to invest $3.87 billion in US chip packaging plant Yahoo Finance
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