AMD CEO Lisa Su Talks Future of Moore's Law and Chip Technology
Originally Published 2 years ago — by Wccftech
AMD CEO, Dr. Lisa Su, states that Moore's Law is not dead but has slowed down and things need to be done differently to overcome the performance, efficiency, and cost challenges. AMD has been the pioneer of advancing 3D packaging and chiplet technology with its first HBM designs back in 2015, chiplet processors in 2017, and also the first 3D packaging on a chip with its 3D V-Cache design in 2022. AMD is already working with 3nm as of right now and that they are also looking at 2nm and beyond that.
