
Intel 18A's BSPDN Leap Wins Tech Edge but Delays Customer Adoption
Intel’s 18A process introduces Backside Power Delivery Network (BSPDN) along with PowerVia and RibbonFET, freeing front-side real estate and boosting power efficiency, but its ground‑up impact on chip design makes external adoption slow. Industry observers expect wider uptake only later in the decade (around 2027), with 14A‑class nodes a more likely external path, though Intel’s early lead still gives it a competitive edge over rivals like TSMC.

