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"Google Pixel 9 to Feature Samsung-Built Tensor G4 with Enhanced Heat Management and Power Efficiency"

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Source: 9to5Google
"Google Pixel 9 to Feature Samsung-Built Tensor G4 with Enhanced Heat Management and Power Efficiency"
Photo: 9to5Google
TL;DR Summary

Google's upcoming Tensor G4 chip is expected to adopt a new packaging method from Samsung, potentially leading to improved power efficiency and heat management. The chip will utilize Samsung's latest 4nm process and a newer Fan-out Wafer Level Packaging (FOWLP) method, building on the success of Tensor G3. This move is seen as a minor upgrade over the existing G3 chip, with Google reportedly planning to transition to TSMC for the release of Tensor G5 in 2025's Pixel 10 series. Tensor G4 is anticipated to be used in the Pixel 9 series and Pixel Fold 2.

Topics:technology#google#heat-management#power-efficiency#samsung#technology#tensor-g4
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  1. Report: Google Tensor G4 to improve heat management and power efficiency  9to5Google
  2. Tensor G4 For The Pixel 9, Pixel 9 Pro To Reportedly Adopt FOWLP Technology, Just Like Samsung’s Exynos 2400  Wccftech
  3. Samsung Foundry 3 nm yields reportedly at "mid to high 50% range"  Notebookcheck.net
  4. Google Pixel 9 may get a big performance upgrade — and it's all thanks to Samsung  Tom's Guide
  5. Samsung may build Google’s next Tensor chip: sources  The Korea Herald

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