Cisco launches AI-optimized Silicon One chip to outpace peers in data-center networking

Cisco unveiled the Silicon One G300 switch chip, built on TSMC’s 3‑nm process, with “shock absorber” features to reroute data in microseconds and speed AI training/inference across massive data centers by about 28%. Slated for sale in the second half of 2026, the chip aims to win share in the AI infrastructure market by competing with Broadcom’s Tomahawk and Nvidia’s networking offerings amid a roughly $600 billion AI-spend boom.